SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 113, Issue , 2014, Pages 123-129

Reflow processes in micro-bumps studied by synchrotron X-ray projection nanotomography

(7) Bertheau, J a,b Bleuet, P b Hodaj, F c Cloetens, P d Martin, N a,b Charbonnier, J b Hotellier, N a

a STMICROELECTRONICS (France)

b CEA GRENOBLE (France)

c UNIV GRENOBLE ALPES (France)

d EUROPEAN SYNCHROTRON RADIATION FACILITY (France)

Author keywords

Interfacial reaction; Intermetallics; Micro bumps; Nanotomography; SnAgCu solder

Indexed keywords

3D CHARACTERIZATION; CHARACTERIZATION METHODS; CHARACTERIZATION TOOLS; HEAT TREATMENT CONDITIONS; INTERMETALLICS COMPOUNDS; MICRO-BUMPS; NANOTOMOGRAPHY; SNAGCU SOLDER;

CHARACTERIZATION; ELECTRONICS PACKAGING; INTERMETALLICS; MICROELECTRONICS; SOLDERING ALLOYS; SURFACE CHEMISTRY;

X RAYS;

EID: 84883536145 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2013.07.013 Document Type: Article

Times cited : (12)

References (17)

1
- 84883522753
- P. Coudrain, J.-P. Colonna, C. Aumont, G. Garnier, P. Chausse, R. Segaud, K. Vial, A. Jouve, T. Mourier, T. Magis, P. Besson, L. Gabette, C. Brunet-Manquat, N. Allouti, C. Laviron, S. Cheramy, E. Saugier, J. Pruvost, A. Farcy, and N. Hotellier IEEE Electron. Packaging Technol. Conf. 2012 335 340
- (2012) IEEE Electron. Packaging Technol. Conf. , pp. 335-340
- Coudrain, P.¹ Colonna, J.-P.² Aumont, C.³ Garnier, G.⁴ Chausse, P.⁵ Segaud, R.⁶ Vial, K.⁷ Jouve, A.⁸ Mourier, T.⁹ Magis, T.¹⁰ Besson, P.¹¹ Gabette, L.¹² Brunet-Manquat, C.¹³ Allouti, N.¹⁴ Laviron, C.¹⁵ Cheramy, S.¹⁶ Saugier, E.¹⁷ Pruvost, J.¹⁸ Farcy, A.¹⁹ Hotellier, N.²⁰ more..

2
- 33845598091
- S.L. Wright, R. Polastre, H. Gan, L.P. Buchwalter, R. Horton, P.S. Andry, E. Sprogis, C. Patel, C. Tsang, J. Knickerbocker, J.R. Lloyd, A. Sharma, and M.S. Sri-Jayantha IEEE Electron. Comp. Technol. Conf. 2006 633 640
- (2006) IEEE Electron. Comp. Technol. Conf. , pp. 633-640
- Wright, S.L.¹ Polastre, R.² Gan, H.³ Buchwalter, L.P.⁴ Horton, R.⁵ Andry, P.S.⁶ Sprogis, E.⁷ Patel, C.⁸ Tsang, C.⁹ Knickerbocker, J.¹⁰ Lloyd, J.R.¹¹ Sharma, A.¹² Sri-Jayantha, M.S.¹³

3
- 81355132127
- Z. Min-Bo, M. Xiao, and Z. Xin-Ping 12th International Conference on Electronic Packaging Technology and High Density Packaging 2011 248 253
- (2011) 12th International Conference on Electronic Packaging Technology and High Density Packaging , pp. 248-253
- Min-Bo, Z.¹ Xiao, M.² Xin-Ping, Z.³

4
- 57349196368
- M. Huang, O.G. Yeow, and C.Y. Poo Packaging Manufacturing Technol. 31 2008 767 775
- (2008) Packaging Manufacturing Technol. , vol.31 , pp. 767-775
- Huang, M.¹ Yeow, O.G.² Poo, C.Y.³

5
- 84883497823
- W.K. Choi, and H.M. Lee J. Electron. Mater. 29 2000 1208 1213
- (2000) J. Electron. Mater. , vol.29 , pp. 1208-1213
- Choi, W.K.¹ Lee, H.M.²

6
- 70449380711
- M. Lu, D.-Y. Shih, C. Goldsmith, and T. Wassick IEEE Reliability Phys. Symp. 2009 149 154
- (2009) IEEE Reliability Phys. Symp. , pp. 149-154
- Lu, M.¹ Shih, D.-Y.² Goldsmith, C.³ Wassick, T.⁴

7
- 84883521597
- H. Ezawa, T. Togasaki, T. Migita, S. Yamashita, M. Inohara, Y. Koshio, M. Fukuda, M. Miyata, K. Nagamine, and T. Lijima Electron. Syst. Integr. Technol. Conf. ECTC 2010 1 6
- (2010) Electron. Syst. Integr. Technol. Conf. ECTC , pp. 1-6
- Ezawa, H.¹ Togasaki, T.² Migita, T.³ Yamashita, S.⁴ Inohara, M.⁵ Koshio, Y.⁶ Fukuda, M.⁷ Miyata, M.⁸ Nagamine, K.⁹ Lijima, T.¹⁰

8
- 0037076832
- K. Zeng, and K.N. Tu Review 38 2002 55 105
- (2002) Review , vol.38 , pp. 55-105
- Zeng, K.¹ Tu, K.N.²

9
- 84883525326
- Chaoran Yan, F. Song, and W.R. Lee Electron. Comp. Technol. Conf. 2010 971 978
- (2010) Electron. Comp. Technol. Conf. , pp. 971-978
- Yan, C.¹ Song, F.² Lee, W.R.³

10
- 84255170962
- G. Martínez-Criado, R. Tucoulou, P. Cloetens, P. Bleuet, S. Bohic, J. Cauzid, I. Kieffer, E. Kosior, S. Labouré, S. Petitgirard, A. Rack, J. Angel Sans, J. Segura-Ruiz, H. Suhonen, J. Susini, and J. Villanova J. Synchro. Radiat. 19 2011 10 18
- (2011) J. Synchro. Radiat. , vol.19 , pp. 10-18
- Martínez-Criado, G.¹ Tucoulou, R.² Cloetens, P.³ Bleuet, P.⁴ Bohic, S.⁵ Cauzid, J.⁶ Kieffer, I.⁷ Kosior, E.⁸ Labouré, S.⁹ Petitgirard, S.¹⁰ Rack, A.¹¹ Angel Sans, J.¹² Segura-Ruiz, J.¹³ Suhonen, H.¹⁴ Susini, J.¹⁵ Villanova, J.¹⁶

11
- 0034297162
- K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker J. Electron. Mater. 29 2000 1122 1136
- (2000) J. Electron. Mater. , vol.29 , pp. 1122-1136
- Moon, K.-W.¹ Boettinger, W.J.² Kattner, U.R.³ Biancaniello, F.S.⁴ Handwerker, C.A.⁵

12
- 0346770027
- S.W. Chen, and H.-H. Wu J. Electron. Mater. 32 2003 1188 1194
- (2003) J. Electron. Mater. , vol.32 , pp. 1188-1194
- Chen, S.W.¹ Wu, H.-H.²

13
- 70349251986
- K. Weinberg, and T. Boehme Transac. Comp. Packaging Technol. 32 2009 684 692
- (2009) Transac. Comp. Packaging Technol. , vol.32 , pp. 684-692
- Weinberg, K.¹ Boehme, T.²

14
- 84883550513
- K. Zeng, and R. Stierman J. Appl. Phys. 97 1997 97 105
- (1997) J. Appl. Phys. , vol.97 , pp. 97-105
- Zeng, K.¹ Stierman, R.²

15
- 0037105149
- A.M. Gusak, and K.N. Tu Phys. Rev. B 66 2002 115403 115416
- (2002) Phys. Rev. B , vol.66 , pp. 115403-115416
- Gusak, A.M.¹ Tu, K.N.²

16
- 0343897894
- S.-W. Chen, and Y.-W. Yen J. Electron. Mater. 28 1999 1203 1208
- (1999) J. Electron. Mater. , vol.28 , pp. 1203-1208
- Chen, S.-W.¹ Yen, Y.-W.²

17
- 84883523453
- Y.S. Park, J.T. Moon, Y.-W. Lee, J.H. Lee, and K.W. Paik IEEE Electron. Comp. Technol. Conf. 2010 1436 1441
- (2010) IEEE Electron. Comp. Technol. Conf. , pp. 1436-1441
- Park, Y.S.¹ Moon, J.T.² Lee, Y.-W.³ Lee, J.H.⁴ Paik, K.W.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.