Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

Materials Science and Engineering: A

Volumn 529, Issue 1, 2011, Pages 468-478

  Tian, Yanhong ^a   Hang, Chunjin ^a   Wang, Chunqing ^a   Yang, Shihua ^a   Lin, Pengrong ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Dynamic shear testing; Fracture behavior; Intermetallic compounds; Size effect; Solder joint

Indexed keywords

BINARY ALLOYS; BRITTLE FRACTURE; COPPER ALLOYS; FRACTURE MECHANICS; LEAD-FREE SOLDERS; NANOPARTICLES; PLASTICITY; RECRYSTALLIZATION (METALLURGY); SCANNING ELECTRON MICROSCOPY; SHEAR FLOW; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; TEXTURES; TIN ALLOYS;

DEFORMATION AND FRACTURE; DEFORMATION BEHAVIOR; DYNAMIC RECOVERY AND RECRYSTALLIZATION; DYNAMIC SHEAR TESTING; DYNAMIC SHEARS; FRACTURE BEHAVIOR; INTERMETALLICS COMPOUNDS; SHEAR TESTING; SIZES EFFECT; SOLDER JOINTS;

INTERMETALLICS;

EID: 80054070088     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.09.063     Document Type: Article

References (27)

1. Lai Y.S., Tong H.M., Tu K.N. Microelectron. Reliab. 2009, 49:221-222.
2. Lee T.K., Liu K.C., Bieler T.R. J. Electron. Mater. 2009, 38:2685-2693.
3. Seo S.K., Kang S.K., Cho M.G., et al. J. Electron. Mater. 2009, 38:2461-2469.
4. Telang A.U., Bieler T.R. Scripta Mater. 2005, 52:1027-1031.
5. Lu M.H., Shih D.Y., Lauro P., Goldsmith C., et al. Appl. Phys. Lett. 2008, 92. 10.1063/1.2936996.
6. Zimprich P., Saeed U., Betzwar-Kotas A. J. Electron. Mater. 2008, 37:102-109.
7. Cugnoni J., Botsis J., Sivasubramaniam V., et al. Fatigue Fract. Eng. Mater. 2007, 30:387-399.
8. Yin L.M., Zhang X.P., Lu C.S. J. Electron. Mater. 2009, 38:2179-2183.
9. Chawla N., Shen Y.L., Deng X., et al. J. Electron. Mater. 2004, 33:1589-1595.
10. Shen Y.L., Chawla N., Ege E.S. Acta Mater. 2005, 53:2633-2642.
11. Bang H., Kim C.U., Kang S.H., et al. J. Electron. Mater. 2009, 38:1896-1905.
12. Darveaux R., Reichman C., Berry C.J., et al. Electronic Components and Technology Conference 2008, 113-122.
13. Chang K.C., Chiang K.N. J. Electron. Mater. 2004, 33:1373-1380.
14. Chia J.Y.H., Cotterell B., Chai, et al. Mater. Sci. Eng. A 2006, 417:259-274.
15. Zhong W.H., Chan Y.C., Alam M.O., et al. J. Alloys Compd. 2006, 414:123-130.
16. Yoon J.W., Jung S.B. J. Alloys Compd. 2008, 458:200-207.
17. Kim J.W., Kim D.G., Jung S.B. Thin Solid Films 2006, 504:405-409.
18. Kim D.G., Kim J.W., Ha S.S., et al. J. Alloys Compd. 2008, 458:253-260.
19. Kar A., Ghosh M., Ray A.K., et al. Mater. Sci. Eng. A 2007, 459:69-74.
20. Lee H.T., Chen M.H., Jao H.M., et al. Mater. Sci. Eng. A 2003, 358:134-141.
21. Zeng K.J., Stierman R., Chiu T.C., et al. J. Appl. Phys. 2005, 97:24508-24515.
22. Park S., Dhakal R., Lehman L., et al. Acta Mater 2007, 55(9):3253-3260.
23. Telang A.U., Bieler T.R., Zamiri A., et al. Acta Mater. 2007, 55:2265-2277.
24. Matin M.A., Vellinga W.P., Geers M.G.D. Mater. Sci. Eng. A 2007, 445:73-85.
25. Bieler T.R., Telang A.U. J. Electron. Mater. 2009, 38:2694-2701.
26. Gong J.C., Liu C.Q., Conway P.P., et al. Scripta Mater. 2009, 61:682-685.
27. Sidhu R.S., Madge S.V., Deng X., et al. J. Electron. Mater. 2007, 36:1615-1620.