Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Materials Science and Engineering: A

Volumn 483-484, Issue 1-2 C, 2008, Pages 620-624

  Koo, Ja Myeong ^a   Kim, Yu Na ^a   Yoon, Jeong Won ^a   Kim, Dae Gon ^a   Noh, Bo In ^a   Kim, Jong Woong ^a   Moon, Jung Hoon ^b   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Suwon Science College   (South Korea)

Author keywords

Bump shear test; Displacement rate; Interfacial reaction; Intermetallic compound (IMC); Sn 37Pb (eutectic tin lead); Solder bump

Indexed keywords

BRITTLE FRACTURE; ELECTROPLATING; FLIP CHIP DEVICES; METALLIZING; SHEAR STRESS; SOLDERING ALLOYS; SURFACE CHEMISTRY;

BUMP SHEAR TEST; ELECTROPLATED SOLDER BUMPS; FLIP-CHIP PACKAGES; UNDER-BUMP METALLIZATION;

INTERMETALLICS;

BRITTLE FRACTURE; ELECTROPLATING; FLIP CHIP DEVICES; INTERMETALLICS; METALLIZING; SHEAR STRESS; SOLDERING ALLOYS; SURFACE CHEMISTRY;

EID: 41849087748     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.11.164     Document Type: Article

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