The influence of solder composition on the impact strength of lead-free solder ball grid array joints

Microelectronics Reliability

Volumn 51, Issue 3, 2011, Pages 657-667

  Tsukamoto, H ^a   Nishimura, T ^b   Suenaga, S ^b   McDonald, S D ^a   Sweatman, K W ^b   Nogita, K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b Nihon Superior Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CU SUBSTRATE; DISPLACEMENT RATE; HIGH SPEED SHEARS; IMC LAYER; INTERFACE INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; NI ADDITIONS; NI-DOPED; REFLOW PROCESS; SOLDER BALLS; SOLDER COMPOSITION; TENSILE IMPACT; TENSILE IMPACT STRENGTH; TENSILE TESTS;

BALL GRID ARRAYS; ELECTRONICS PACKAGING; IMPACT STRENGTH; INTERMETALLICS; LEAD; SHEAR STRENGTH; SILVER; SOLDERING; SOLDERING ALLOYS; TENSILE STRENGTH; TENSILE TESTING;

TIN;

EID: 79951956120     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.10.012     Document Type: Article

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