Brittle versus ductile failure of a lead-free single solder joint specimen under intermediate strain rate

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 9, 2011, Pages 1456-1464

  Jing, Jianping ^a   Gao, Feng ^b,c   Johnson, Janine ^b,d   Liang, Frank Z ^e   Williams, Richard L ^e   Qu, Jianmin ^b,c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c Northwestern University   (United States)

^d MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^e INTEL CORPORATION   (United States)

Author keywords

Failure mode; plastic deformation; single solder joint; Sn 4.0Ag 0.5Cu solder

Indexed keywords

BRITTLE FAILURES; COHESIVE FAILURES; DISPLACEMENT RATE; DUCTILE FAILURES; ELASTIC-PLASTIC; INTERMEDIATE STRAIN RATE; LEAD-FREE; LOADING RATE; MIXED MODE; SHEAR LOADINGS; SHEAR TESTS; SOLDER ALLOYS; SOLDER BALLS; SOLDER JOINT SPECIMEN; SOLDER JOINTS; SOLDER MATRIX; SOLDER PROPERTIES; TENSILE TESTS; UNIAXIAL TENSILE TEST;

COMPUTER SIMULATION; FAILURE MODES; INTERMETALLICS; PLASTIC DEFORMATION; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; STRAIN RATE; STRESS CONCENTRATION; TENSILE TESTING; TIN; TIN ALLOYS;

LOADING;

EID: 84859803297     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2146259     Document Type: Article

References (12)

1. S. L. Choi, A. W. Gibson, J. L. McDougall, T. R. Bieler, and K. N. Subramanian, Design Reliability of Solders and Solder Interconnections, R. K. Mahidhara, D. R. Fear, and K. L. Murty, Eds. Warrendale, PA: TMS, 1977, pp. 241-245.
2. R. W. Neu, D. T. Scott, and M. W. Woodmansee, "Thermomechanical behavior of 96Sn-4Ag and casting alloy," Trans. ASME J. Electron. Packag., vol. 123, no. 3, pp. 238-246, Sep. 2001. (Pubitemid 33609790)
3. X. Long, I. Dutta, V. Sarihan, and D. R. Frear, "Deformation behavior of Sn-3.8Ag-0.7Cu solder at intermediate strain rates: Effect of microstructure and test conditions," J. Electron. Mater., vol. 37, no. 2, pp. 189-200, 2008. (Pubitemid 350275996)
4. J.-W. Kim and S.-B. Jung, "Reexamination of the solder ball shear test for evaluation of the mechanical joint strength," Int. J. Solids Struct., vol. 43, nos. 7-8, pp. 1928-1945, Apr. 2006. (Pubitemid 43220539)
5. O. van der Sluis, R. B. R. van Silfhout, R. A. B. Engelen, W. D. van Driel, and G. Q. Zhang, "A numerical method for efficient failure modelling of 3-D bond pad structures," in Proc. Electron. Comp. Technol. Conf., Reno, NV, 2007, pp. 235-241. (Pubitemid 47577036)
6. C.-L. Yeh and Y.-S. Lai, "Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test," J. Electron. Mater., vol. 35, no. 10, pp. 1892-1901, 2006. (Pubitemid 44600632)
7. C. R. Siviour, D. M. Eilliamson, S. J. P. Palmer, S. M. Walley, W. G. Proud, and J. E. Field, "Dynamic properties of solders and solder joints," J. Phys., IV, vol. 110, no. 1, pp. 477-482, Sep. 2003.
8. K. Kaminishi, T. Sekine, T. Maruichi, and S. Osaki, "Impact tensile characteristics of Sn-3.0Ag-0.5 Cu lead-free solder," Trans. Jpn. Soc. Mech. Eng., vol. 70, no. 690, pp. 266-272, 2004.
9. P. Zimprich, U. Saeed, A. Betzwar-Kotas, B. Weiss, and H. Ipser, "Mechanical size effects in miniaturized lead-free solder joints," J. Electron. Mater., vol. 37, no. 1, pp. 102-109, 2008. (Pubitemid 350276015)
10. J. C. Gong, C. Q. Liu, P. P. Conway, and V. V. Silberschmidt, "Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation," Comput. Mater. Sci., vol. 39, no. 1, pp. 187-197, Mar. 2007. (Pubitemid 46186991)
11. D. Suh, D. W. Kim, P. L. Liu, H. C. Kim, J. A. Weninger, C. M. Kumar, A. Prasad, B. W. Grimsley, and H. B. Tejada, "Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions," Mater. Sci. Eng.: A, vols. 460-461, pp. 595-603, Jul. 2007. (Pubitemid 46593846)
12. R. H. Dauskardt, M. Lane, Q. Ma, and N. Krishna, "Adhesion and debonding of multilayer thin film structures," Eng. Fract. Mech., vol. 61, no. 1, pp. 141-162, Aug. 1998. (Pubitemid 29111653)