Elimination of voids in reactions between Ni and Sn: A novel effect of silver

Scripta Materialia

Volumn 66, Issue 3-4, 2012, Pages 171-174

  Chuang, H Y ^a   Yu, J J ^a   Kuo, M S ^a   Tong, H M ^b   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Aging; Coarsening; Interface diffusion; Intermetallic compounds; Soldering

Indexed keywords

BONDING JOINTS; CONFINED SPACE; INTERFACE DIFFUSION; SPACE CONFINEMENT; THREE DIMENSIONAL INTEGRATED CIRCUITS;

AGING OF MATERIALS; COARSENING; INTERMETALLICS; SOLDERING; TIN;

WAFER BONDING;

EID: 82255164230     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.10.032     Document Type: Article

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