Intermetallic compound growth and reliability of Cu pillar bumps under current stressing

Journal of Electronic Materials

Volumn 39, Issue 10, 2010, Pages 2281-2285

  Kim, Byoung Joon ^a   Lim, Gi Tae ^b   Kim, Jaedong ^c   Lee, Kiwook ^c   Park, Young Bae ^b   Lee, Ho Young ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

^b Andong National University   (South Korea)

^c Amkor Technology Korea Inc   (South Korea)

Author keywords

Cu pillar bump; Die shear strength; Intermetallic compound

Indexed keywords

CU PILLAR; CURRENT-STRESSING; FLIP-CHIP BONDING; IN-SITU OBSERVATIONS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND GROWTHS; KIRKENDALL VOID; MECHANICAL RELIABILITY; MECHANICAL STRENGTH; SHEAR FORCE; UNDER BUMP METALLIZATION;

ANNEALING; DIES; INTERMETALLICS; RELIABILITY; SHEAR STRENGTH; TIN;

FLIP CHIP DEVICES;

EID: 78149406065     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1324-z     Document Type: Article

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