SCOPUS 정보 검색 플랫폼

Volumn 458, Issue 1-2, 2008, Pages 253-260

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Author keywords

Flip chip; Interfacial reaction; Shear force; Sn 3.0Ag 0.5Cu; Sn 37Pb

Indexed keywords

ELECTROLESS PLATING; FLIP CHIP DEVICES; INTERMETALLICS; NICKEL PLATING; SOLDERED JOINTS;

MICROSTRUCTURAL VARIATION; SHEAR FORCE; UNDER BUMP METALLURGY (UBM);

SURFACE CHEMISTRY;

EID: 42949086874 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2007.04.042 Document Type: Article

Times cited : (30)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.