Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

Microelectronics Reliability

Volumn 53, Issue 1, 2013, Pages 47-52

  Chen, Y J ^a   Chung, C K ^a   Yang, C R ^b   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN NORMAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGING PROCESS; AGING TIME; CONTRIBUTING FACTOR; CU PILLAR; MICROSTRUCTURE CHARACTERIZATION; PLANARIZATION; SHEAR TESTS; SOLDER BUMP; SOLDER JOINTS; SOLDER-JOINT STRENGTH; VOID FORMATION;

FLIP CHIP DEVICES; INTERMETALLICS; MORPHOLOGY;

TIN;

EID: 84872098975     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.06.116     Document Type: Article

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