Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 535-542

  Kim, Jong Woong ^a   Kim, Dae Gon ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATION THEORY; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; FLIP CHIP DEVICES; SILVER COMPOUNDS; TIN COMPOUNDS;

PLASTIC STRAIN; SOLDER BUMPS; SOLDER PASTE; STENCIL PRINTING;

SOLDERED JOINTS;

EID: 30944460146     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.06.008     Document Type: Article

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