Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Acta Materialia

Volumn 59, Issue 3, 2011, Pages 1198-1211

  Li, J F ^a   Agyakwa, P A ^a   Johnson, C M ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

Analytical methods; Copper; Interdiffusion; Intermetallic compounds; Kinetics

Indexed keywords

ANALYTICAL METHOD; BASE METALS; BOUNDARY PLANES; COLUMNAR CRYSTALS; CONTROLLED GROWTH; CU FOIL; FORMING GAS; INTER-DIFFUSION; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; KINETIC CONSTANT; MECHANISM AND KINETICS; PURE SN; SOLDERING PROCESS; THIN INTERLAYERS; TIME DEPENDENCE; TRANSIENT LIQUID PHASE; VOLUME DIFFUSION;

GRAIN GROWTH; INTERMETALLICS; LIQUIDS; METAL CLADDING; METAL FOIL; RATE CONSTANTS; REACTION KINETICS;

TIN;

EID: 78650699789     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.10.053     Document Type: Article

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