Intermetallic formation of copper pillar with Sn-Ag-Cu for flip-chip-on-module packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 4, 2008, Pages 767-775

  Huang, Mark ^a   Yeow, Ong Gee ^b   Poo, Chia Yong ^a   Jiang, Tom ^a  

^a MICRON TECHNOLOGY INC   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Copper pillar interconnects; Flip chip on module (FCOM); Intermetallics; Sn Ag Cu alloy

Indexed keywords

BRAZING; CHIP SCALE PACKAGES; ELECTRIC BATTERIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HIGH TEMPERATURE SUPERCONDUCTORS; INTERMETALLICS; LEAD; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHOCK TESTING; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN; TIN ALLOYS; WELDING;

BULK SOLDERS; COPPER MIGRATIONS; COPPER PILLAR INTERCONNECTS; COPPER PILLARS; ELECTRICAL PERFORMANCES; ENERGY DISPERSIVE; FLIP-CHIP-ON-MODULE (FCOM); HIGH DENSITIES; HIGH FREQUENCIES; HIGH TEMPERATURES; INTER-CONNECTS; INTERMETALLIC COMPOUNDS; INTERMETALLIC FORMATIONS; LEAD-FREE; MODULE PACKAGING; MULTIPLE REFLOWS; ORGANIC SOLDERABILITY PRESERVATIVES; SCANNING ELECTRON MICROSCOPES; SEM-EDX; SN-AG-CU; SN-AG-CU ALLOY; SOLDER PASTES; SURFACE FINISHES; WEAK INTERFACES;

COPPER;

EID: 57349196368     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001194     Document Type: Article

References (12)

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