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Volumn 364, Issue 1-2, 2004, Pages 240-243
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Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation
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Author keywords
Intermetallic; Nanoindentation; Solder; Young's modulus
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Indexed keywords
COPPER COMPOUNDS;
ELASTIC MODULI;
INDENTATION;
POROSITY;
SILVER COMPOUNDS;
SOLDERED JOINTS;
SOLDERING ALLOYS;
NANOINDENTATION;
INTERMETALLICS;
INTERMETALLIC ALLOY;
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EID: 0742287928
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2003.08.032 Document Type: Article |
Times cited : (166)
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References (22)
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