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Volumn 364, Issue 1-2, 2004, Pages 240-243

Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation

Author keywords

Intermetallic; Nanoindentation; Solder; Young's modulus

Indexed keywords

COPPER COMPOUNDS; ELASTIC MODULI; INDENTATION; POROSITY; SILVER COMPOUNDS; SOLDERED JOINTS; SOLDERING ALLOYS;

EID: 0742287928     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.08.032     Document Type: Article
Times cited : (166)

References (22)
  • 4
    • 0742322415 scopus 로고    scopus 로고
    • D.R. Frear, JOM, 1996, pp. 49-53.
    • (1996) JOM , pp. 49-53
    • Frear, D.R.1
  • 5
    • 85161688750 scopus 로고    scopus 로고
    • R.J. Fields, S.R. Low, http://www.metallurgy.nist.gov/ mechanical_properties/solder_paper.html
    • Fields, R.J.1    Low, S.R.2
  • 10
    • 85161655931 scopus 로고    scopus 로고
    • unpublished work
    • R.J. Fields, 2002, unpublished work.
    • (2002)
    • Fields, R.J.1
  • 12
    • 0001684266 scopus 로고    scopus 로고
    • Instrumented indentation testing
    • H. Kuhn, D. Medlin (Eds.), ASM International, Materials Park, OH
    • J.L. Hay, G.M. Pharr, Instrumented Indentation Testing, in: H. Kuhn, D. Medlin (Eds.), ASM Handbook, ASM International, Materials Park, OH, 2001, pp. 232-243.
    • (2001) ASM Handbook , pp. 232-243
    • Hay, J.L.1    Pharr, G.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.