Pb-free solder-alloy based on Sn-Zn-Bi with the addition of germanium

Journal of Alloys and Compounds

Volumn 497, Issue 1-2, 2010, Pages 428-431

  Wang, Shuo Hong ^a   Chin, Tsung Shune ^a,b   Yang, Ching Feng ^a   Chen, Sinn Wen ^a   Chuang, Chin Tzuan ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b FENG CHIA UNIVERSITY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Coefficient of thermal expansion; Electrical resistivity; Ge addition; Pb free solder; Tensile strength

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; ELECTRICAL RESISTIVITY; GE ADDITION; PB FREE SOLDERS; PB-FREE SOLDER;

ALLOYS; ELECTRIC CONDUCTIVITY; GERMANIUM; LEAD; SMELTING; SOLDERING ALLOYS; TENSILE STRENGTH; THERMAL EXPANSION; THERMAL STRESS; TIN ALLOYS; VICKERS HARDNESS; ZINC;

TIN;

EID: 77951091398     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.03.094     Document Type: Article

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