Solder paste characterisation: Towards the development of quality control (QC) tool

Soldering and Surface Mount Technology

Volumn 20, Issue 3, 2008, Pages 34-40

  Durairaj, R ^a   Mallik, S ^b   Ekere, N N ^b  

^a UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Creep; Flux; Quality control; Rheology; Solder paste; Viscosity

Indexed keywords

BRAZING; COLLOIDS; CREEP; CUSTOMER SATISFACTION; HYDRODYNAMICS; INDUSTRIAL ENGINEERING; MANUFACTURE; PRINTING; PROBLEM SOLVING; QUALITY ASSURANCE; QUALITY FUNCTION DEPLOYMENT; QUANTUM CHEMISTRY; RECOVERY; RESEARCH; RHEOLOGY; TESTING; TOOLS; TOTAL QUALITY MANAGEMENT; VISCOSITY; WELDING;

CHARACTERISATION; CREEP-RECOVERY TEST; DESIGN/METHODOLOGY/APPROACH; FLUX MEDIUM; GAP HEIGHT; IN ORDER; PARALLEL PLATES; PRACTICAL IMPLICATIONS; PRINTING PROCESSES; PRODUCTION STAFF; QUALITY CONTROL TOOLS; RESEARCH AND DEVELOPMENT; RHEOLOGICAL FLOW; RHEOLOGICAL TESTING; SOLDER PASTES; TEST METHODS;

QUALITY CONTROL;

EID: 46749083051     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910810885705     Document Type: Article

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