Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 4, 2011, Pages 495-501

  Cao, Xiao ^a   Wang, Tao ^a   Ngo, K D T ^a   Lu, Guo Quan ^a  

^a State University   (United States)

Author keywords

Die attach; lead free solder; power insulated gate bipolar transistor; sintered nano silver; thermal cycling; thermal impedance measurement

Indexed keywords

DIE-ATTACH; DIE-ATTACH MATERIALS; HIGH TEMPERATURE SENSITIVITY; JUNCTION TEMPERATURES; LEAD FREE SOLDERS; NANO SILVER; TEMPERATURE-SENSITIVE; THERMAL IMPEDANCE;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT); MIXED CONVECTION; SILVER; SINTERING; THERMAL CYCLING;

DIES;

EID: 81855181413     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2104958     Document Type: Article

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