The reliability nomograph - Graphical predictor of package/module interconnect reliability

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 2, 1997, Pages 146-151

  Iannuzzelli, Ray ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

Ceramic ball grid array; Ceramic column grid array; Package printed wiring board; Plastic ball grid array; Thin small outline packages

Indexed keywords

COMPUTER HARDWARE; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NOMOGRAMS; RELIABILITY; SOLDERING;

CERAMIC COLUMN GRID ARRAY (CCGA); GRAPHICAL PREDICTORS; NORRIS-LANSBERG MODEL; PLASTIC QUAD FLAT PACKS (PQFP); THIN SMALL OUTLINE PACKAGES (TSOP);

INTERCONNECTION NETWORKS;

EID: 0031169724     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.588566     Document Type: Article

References (3)

1. R. Iannuzzelli, "Predicting solder joint reliability - model validation," in Proc. 43rd ECTC, May 1993.
2. _, "Application of integrated matrix creep to solder joint reliability prediction," ASME, no. 95-WA/EEP-2, Nov. 1995.
3. J. Seyyedi, R. Iannuzzelli, and J. Bukhari, "Reliability evaluation of TSOP solder joints for PC card application," Solder Surface Mount Technol., no. 23, June 1996.