A novel high performance die attach for ceramic packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 168-171

  Shi, J Z ^a   Xie, X M ^a   Stubhan, F ^b   Freytag, J ^b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b DAIMLER AG   (Germany)

Author keywords

Die bonding; Die shear strength; Isothermal solidification; Microstructures; Thermal cycle test

Indexed keywords

EID: 0041779683     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483150     Document Type: Article

References (12)

1. Bernstein, L., 1966, “Semiconductor joining by the solid-interdiffusion,” J. Electrochem. Soc., 113, p. 1282.
2. Bernstein, L., and Bartholomew, H., 1996, “Application of solid-liquid interdiffusion bonding in integrated-circuit fabrication,” Trans. Metall. Soc. AIME, 236, p. 405.
3. Schmid-Fetzer, R., 1995, “Fundamentals of bonding by isothermal solidification for high temperature semiconductor application,” Design Fundamentals of High Temperature Composites, Intermetallics and Metal-Ceramics System, R. Y. Lin, Y. A. Chang, R. G. Reddy, and C. T. Liu, eds., The Minerals, Metals and Materials Society.
4. Lee, C. C., Wang, C. Y., and Matijasevic, G., 1993, “Au-In bonding below the eutectic temperature,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, p. 311.
5. Chen, Y. C., William, W. So, and Lee, C. C., 1997, “A fluxless bonding technology using indium-silver multilayer composites,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, No. 1, p. 46.
6. Okamoto, O. and Massalski, M. eds., 1987, “The Au-In system,” Phase Diagrams of Binary Gold Alloys, ASM International, Metals Park, OH, p. 142.
7. Wang, T. B., Shen, Z. Z., Ye, R. Q., Xie, X. M., Stubhan, F., and Freytag, J., 2000, “Die Bonding with Au/In Isothermal Solidification Technique,” accepted for publication in Journal of Electronic Materials.
8. Wang, T. B., and Xie, X. M., Ye, R. Q., Stubhan, F., and Freytag, J., 1999, “Microstructure Characterization of Die Bonding with Au/In Isothermal Solidification Technique,” Submitted for publication in IEEE Trans. Compon., Hybrids, Manuf. Technol., Part A, Advanced Packaging.
9. Powell, G. W., and Braun, J. D., 1964, “Diffusion in gold-indium system,” Trans. Metall. Soc. AIME, 230, p. 694.
10. Hasumi, Y., 1985, “Lateral diffusion of In and formation of AuIn2 in Au-In thin films,” J. Appl. Phys., 58, p. 3081.
11. Simic, V., and Marinkovic, Z., 1992, “Stability of compounds in thin film metal couples in the course of long aging at room temperature,” Thin Solid Films, 209, p. 181.
12. Bjontegaard, J., Buene, L., Finstad, T., Lonsjo, O., and Olsen, T., 1983, “Low temperature interdiffusion in Au/In thin film couples,” Thin Solid Films, 101, p. 253.