Erratum: Development of Glass-Free Metal Electrically Conductive Thick Films (ASME J. Electron. Packag. (2022) 123:1 (64-69) DOI: 10.1115/1.1329131);Development of glass-free metal electrically conductive thick films

Journal of Electronic Packaging

Volumn 123, Issue 1, 2001, Pages 64-69

  Liu, Zongrong ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Electrical; Glass; Metal; Paste; Resistivity; Thick Film

Indexed keywords

EID: 0038843790     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1371772     Document Type: Erratum

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