Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder in potassium hydroxide electrolyte

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 43, Issue 10, 2012, Pages 3742-3747

  Liew, Mui Chee ^a   Ahmad, Ibrahym ^a   Lee, Liu Mei ^a   Nazeri, Muhammad Firdaus Mohd ^a   Haliman, Habsah ^a   Mohamad, Ahmad Azmin ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION BEHAVIOR; CORROSION CURRENT DENSITIES; CORROSION POTENTIALS; CORROSION PRODUCTS; LEAD FREE SOLDERS; MICRO-STRUCTURAL; POLARIZATION ANALYSIS; SN-3.0AG-0.5CU; SOLDER ALLOYS;

CORROSIVE EFFECTS; ELECTROLYTES; POTASSIUM HYDROXIDE; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; TIN OXIDES;

TIN;

EID: 84867233067     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-012-1194-5     Document Type: Article

References (17)

1. D. Li, P.P. Conway, and C. Liu: Corros. Sci., 2008, vol. 50, pp. 995-1004.
2. F. Rosalbino, E. Angelini, G. Zanicchi, R. Carlini, and R. Marazza: Electrochim. Acta, 2009, vol. 54, pp. 7231-35.
3. F. Rosalbino, E. Angelini, G. Zanicchi, R. Carlini, and R. Marazza: Mater. Chem. Phys., 2008, vol. 109, pp. 386-91.
4. C.Q. Cheng, F. Yang, J. Zhao, L.H. Wang, and X.G. Li: Corros. Sci., 2011, vol. 53, pp. 1738-47.
5. B.Y. Wu, Y.C. Chan, and M.O. Alam: J. Mater. Res., 2006, vol. 21, p. 62.
6. H. Mohran, A.-R. El-Sayed, and H. Abd El-Lateef: J. Solid State Electrochem., 2009, vol. 13, pp. 1279-90.
7. H. Chang, H. Chen, M. Li, L. Wang, and Y. Fu: J. Electron. Mater., 2009, vol. 38, pp. 2170-78.
8. P.E. Alvarez, S.B. Ribotta, M.E. Folquer, C.A. Gervasi, and J.R. Vilche: Corros. Sci., 2002, vol. 44, pp. 49-65.
9. S.S.A. El Rahim, A. El Sayed, and A.A. El Samahi: Surf. Coat. Technol., 1986, vol. 27, pp. 205-17.
10. F.A. Cotton and G. Wilkinson: Advanced Inorganic Chemistry, Wiley, London, U.K., 1972, pp. 330.
11. C.A. Gervasi, P.A. Palacios, M.V. Fiori Bimbi, and P.E. Alvarez: J. Electroanal. Chem., 2010, vol. 639, pp. 141-46.
12. J.S. Hwang: Environmentally-Friendly Electronics: Lead Free Technology, Electrochemical Publications, Ltd., Isle of Man, 2001.
13. K.S. Kim, S.H. Huh, and K. Suganuma: Mater. Sci. Eng. A, 2002, vol. 333, pp. 106-14.
14. M. Abtew and G. Selvaduray: Mater. Sci. Eng. R, 2000, vol. 27, pp. 95-141.
15. M. Reid, J. Punch, M. Collins, and C. Ryan: Soldering & Surface Mount Technology, Emerald Group Publishing Limited, Bingley, U.K., 2008, pp. 3-8.
16. J.W. Yoon and S.B. Jung: J. Alloys Compd., 2008, vol. 448, pp. 177-184.
17. R.S. Sidhu, S.V. Madge, X. Deng, and N.J. Chawla: J. Electron. Mater., 2007, vol. 36, p. 1615.