Reliability studies of surface mount solder joints - Effect of Cu-Sn intermetallic compounds

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 3, 1996, Pages 661-668

  So, Alex C K ^b   Chan, Yan C ^a,b  

^a IEEE

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; LEAD METALLURGY; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR GROWTH; SURFACE MOUNT TECHNOLOGY; X RAY ANALYSIS;

ENERGY DISPERSIVE X RAY; INFRARED REFLOW PROCESS; LEAD METALLIZATION; THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 0030216469     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.533909     Document Type: Article

References (17)

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