The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering

Journal of Alloys and Compounds

Volumn 492, Issue 1-2, 2010, Pages 433-438

  Liu, Xiaoying ^a   Huang, Mingliang ^a   Zhao, Yanhui ^a   Wu, C M L ^b   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Adsorption; Ag3Sn; Cu6Sn5; Intermetallic compound (IMC); Sn 3Ag 0.5Cu

Indexed keywords

AG3SN; AVERAGE SIZE; CU SUBSTRATE; CU-SN INTERMETALLICS; FIXED TEMPERATURE; IN-LINE; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; PERPENDICULAR ORIENTATION; SOLDERING TEMPERATURE; SOLIDIFICATION PROCESS; SURFACE ORIENTATION;

ADSORPTION; NANOPARTICLES; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 76549124422     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.11.131     Document Type: Article

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