Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu(ENIG) sandwich solder joints

Journal of Alloys and Compounds

Volumn 448, Issue 1-2, 2008, Pages 177-184

  Yoon, Jeong Won ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Coupling effect; Electroless nickel immersion gold (ENIG); Interfacial reaction; Sn Ag Cu solder

Indexed keywords

COPPER ALLOYS; ELECTROLESS PLATING; INTERMETALLICS; NICKEL; SANDWICH STRUCTURES; SURFACE CHEMISTRY;

COUPLING EFFECT; INTERFACIAL REACTION;

SOLDERED JOINTS;

EID: 35748940610     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.10.052     Document Type: Article

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