Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints

Journal of Materials Science: Materials in Electronics

Volumn 11, Issue 6, 2000, Pages 497-502

  Choi, S ^a   Lucas, J P ^a   Subramanian, K N ^a   Bieler, T R ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; DIFFUSION; EUTECTICS; NICKEL ALLOYS; REACTION KINETICS; SOLDERED JOINTS; SUBSTRATES; THERMAL EFFECTS; TIN ALLOYS;

INTERFACIAL INTERMETALLIC COMPOUND LAYERS (IMC);

SOLDERING ALLOYS;

EID: 0034240674     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008968518512     Document Type: Article

References (17)

1. A. J. SUNWOO, J. W. MORRIS and G. K. LUCEY, JR., Metall. Trans. A 23 (1992) 1323.
2. D. R. FREAR and P. T. VIANCO, ibid. 25 (1994) 1509.
3. D. GRIVAS, D. R. FREAR, L. QUAN and J. W. MORRIS, Jr. J. Electron Mater. 15 (1986) 355.
4. Z. MEI, A. J. SUNWOO and J. W. MORRIS, Jr., Metall. Trans. A 23 (1992) 857.
5. R. F. PINIZZOTTO, Y. WU, E. G. JACOBS and L. A. FOSTER, in Proceedings of Technical Program-National Electronic Packaging and Production Conference (NEPCON West 92), Anaheim, CA, February 1992, p. 1284.
6. Y. WU, J. A. SEES, C. POURAGHABAGHER, L. A. FOSTER, J. L. MARCHALL, E. G. JACOBS and R. F. PINIZZOTTO, J. Electron Mater. 22 (1993) 769.
7. W. YANG and R. W. MESSLER, Jr., ibid. 23 (1994) 765.
8. D. R. FLANDER, E. G. JACOBS and R. F. PINIZZOTTO, ibid. 26 (1997) 883.
9. M. E. WARWICK and S. J. MUCKETT, Circuit World 9 (1983) 5.
10. J. LONDON and D. W. ASHALL, Brazing and Soldering 11 (1986) 49.
11. J. O. G. PARENT, D. D. L. CHUNG and I. M. BERSTEIN, J. Mater. Sci. 23 (1988) 2564.
12. S. F. DIRFELD and J. J. RAMON, Weld. J. Res. Suppl. (1990) 373s.
13. S. CHOI, T. R. BIELER, J. P. LUCAS and K. N. SUBRAMANIAN, J. Electron. Mater. 28 (1999) 1209.
14. "Binary Alloy Phase Diagrams", edited by T.B. Massalski (Metals Park, OH: American Society for Metals, 1986) 1 (1986) 1774.
15. A. W. GIBSON, S. CHOI, K. N. SUBRAMANIAN and T. R. BIELER, in Proceedings of Symposium on Design and Reliability Solders and Solder Interconnections, Orlando, FL, February 1997, edited by R.K. Mahidhara et al. (TMS, Warrendale, PA, 1997) p. 97.
16. W. YANG, L. E. FELTON and R. W. MESSLER, Jr., J. Electron. Mater. 24 (1995) 1465.
17. W. L. WINTERBOTTOM, JOM 45 (1993) 20.