Formation and Growth Kinetics of Interfacial Intermetallics in Pb-Free Solder Joint

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 651-658

  Li, G Y ^a   Chen, B L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Intermetallic compound; Lead free solder; Phase lag model; Solder joint

Indexed keywords

COPPER; DIFFUSION; GROWTH KINETICS; INTERMETALLICS; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; X RAY DIFFRACTION ANALYSIS;

INTERFACIAL INTERMETALLICS;

ELECTRONICS PACKAGING;

EID: 0142165074     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817860     Document Type: Article

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