Effect of copper addition on the microstructure and mechanical properties of lead free solder alloy

Materials Science and Engineering: A

Volumn 459, Issue 1-2, 2007, Pages 69-74

  Kar, Abhijit ^a   Ghosh, Mainak ^a   Ray, Ajoy Kumar ^a   Ghosh, Rabindra Nath ^a  

^a NATIONAL METALLURGICAL LABORATORY   (India)

Author keywords

Dimple fracture; Intermetallic compound; Lead free solder alloy; Shear strength

Indexed keywords

ADDITION REACTIONS; BRITTLENESS; COPPER; EUTECTICS; INTERMETALLICS; SHEAR STRENGTH; SOLDERED JOINTS;

DIMPLE FRACTURE; LEAD FREE SOLDER ALLOY;

SOLDERING ALLOYS;

ADDITION REACTIONS; BRITTLENESS; COPPER; EUTECTICS; INTERMETALLICS; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS;

EID: 34247104974     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.084     Document Type: Article

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