Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films

Journal of Applied Physics

Volumn 80, Issue 5, 1996, Pages 2774-2780

  Liu, Ann A ^a   Kim, H K ^a   Tu, K N ^a   Totta, Paul A ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001138647     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.363728     Document Type: Article

References (12)

1. R. N. Wild, presentation at the National Center for Manufacturing Science Meeting on "Environmentally Conscious Manufacturing," Owego, NY, July, 1993 (unpublished).
2. Treatise on Materials Science and Technology, edited by K. N. Tu and R. Rosenberg (Academic, Yorktown Heights, New York, 1982), Vol. 24.
3. B. S. Berry and I. Ames, IBM J. Res. Dev. 13, 286 (1969).
4. P. A. Totta and R. P. Sopher, IBM J. Res. Dev. 13, 226 (1969).
5. H. K. Kim, K. N. Tu, and P. A. Totta (unpublished).
6. H. K. Kim, H. K. Liou, and K. N. Tu, J. Mater. Res. 10, 497 (1995).
7. D. S. Dunn, T. F. Marnis, W. M. Sherry, and C. J. Williams, in Electronic Packaging Materials Science, edited by E. A. Giess, K.-N. Tu, and D. R. Uhlmann (Mater. Res. Soc., Pittsburgh, PA, 1985), Proc. Vol. 40, p. 129.
8. Y. Wu, J. A. Sees, C. Pouraghabagher, L. A. Foster, J. Marshall, E. G. Jacobs, and R. F. Pinizzotto, J. Electron. Mater. 22, 769 (1993).
9. Metals Handbook, 9th ed. (American Society for Metals, Metals Park, OH, 1985), Vol. 9, p. 416.
10. M. Hansen, Constitution of Binary Alloys (McGraw-Hill, New York, 1958), p. 610.
11. P. Haasen, Physical Metallurgy, 2nd ed. (Cambridge University Press, Cambridge, 1986), p. 214.
12. H. K. Kim and K. N. Tu, Appl. Phys. Lett. 67, 2002 (1995).