Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflow

Soldering and Surface Mount Technology

Volumn 25, Issue 1, 2013, Pages 15-23

  Lee, Liu Mei ^a   Haliman, Habsah ^a   Mohamad, Ahmad Azmin ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

Alloys; Intermetallics; Lead free; SAC305; Solders; Thermal properties; Thin films

Indexed keywords

CONSTANT TEMPERATURE; COPPER SUBSTRATES; CU SUBSTRATE; DESIGN/METHODOLOGY/APPROACH; FILM CHARACTERISTICS; HOT PLATES; INTERFACIAL REGION; LEAD FREE SOLDERS; LEAD-FREE; REFLOW TEMPERATURES; SAC305; SN-3.0AG-0.5CU; SOLDER REFLOW; THERMAL EVAPORATION TECHNIQUE;

ALLOYS; CERIUM ALLOYS; DEPOSITS; INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL EVAPORATION; THERMODYNAMIC PROPERTIES; THIN FILMS; TIN;

VAPOR DEPOSITION;

EID: 84874353392     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911311294560     Document Type: Article

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