High speed digital image correlation for transient-shock reliability of electronics

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 2, 2009, Pages 378-395

  Lall, Pradeep ^a   Panchagade, Dhananjay R ^a   Iyengar, Deepti ^a,b   Shantaram, Sandeep ^a   Schrier, Hubert ^c  

^a AUBURN UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

^c Correlated Solutions ^*  (United States)

Author keywords

Failure analysis; Finite element methods; Reliability modeling; Reliability testing

Indexed keywords

BEAM MODEL; COPPER TRACES; DIGITAL IMAGE CORRELATIONS; DROP IMPACT; ELECTRONICS ASSEMBLY; EXPERIMENTAL DATA; EXPLICIT FINITE ELEMENTS; FAILURE ENVELOPE; FINITE-ELEMENT MODELS; FULL-FIELD; FULL-FIELD MEASUREMENT; HIGH SPEED IMAGE; HIGH SPEED IMAGING; HIGH-SPEED; HIGH-SPEED DATA; JOINT FAILURE; LEAD-FRAME PACKAGE; LIFE PREDICTIONS; OPTICAL MEASUREMENT; PROPERTY MODELS; RELATIVE DISPLACEMENT; RELIABILITY MODELING; RELIABILITY TESTING; SHOCK AND VIBRATION; SHOCK RELIABILITY; STRAIN DEFORMATION; SUBMODELS; TRANSIENT DYNAMICS; TRANSIENT STRAIN; ULTRA HIGH SPEED; UNDERFILLS;

BALL GRID ARRAYS; BRAZING; DEFORMATION; DIGITAL IMAGE STORAGE; FINITE ELEMENT METHOD; FRACTURE; IMAGE ANALYSIS; MEASUREMENTS; OPTICAL DATA PROCESSING; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SAFETY FACTOR; SPEED; STRAIN; STRAIN GAGES; STRAIN MEASUREMENT; WELDING;

FAILURE ANALYSIS;

EID: 68349160549     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2020915     Document Type: Article

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