Effect of intermetallic compounds on reliability of Sn-Ag-Cu flip chip solder interconnects for different substrate pad finishes and Ni/Cu UBM

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 68-74

  Gupta, Piyush ^a   Doraiswami, Ravi ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS NICKLE IMMERSION GOLD (ENIG); ORGANIC SOLDERABILITY PRESERVATIVE (OSP); SEMICONDUCTOR INDUSTRY;

ELECTRIC RESISTANCE; INTERMETALLICS; LEAD ALLOYS; OPTICAL INTERCONNECTS; RELIABILITY; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

FLIP CHIP DEVICES;

EID: 10444241845     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. th Electronic Components and Technology Conf, Las Vegas, Nevada, May. 2000, pp. 1106-1110.
2. th Electronic Components and Technology Conf, New Orleans, Louisiana, May. 2003, pp. 323-329.
3. th Electronic Components and Technology Conf, New Orleans, Louisiana, May. 2003, pp. 323-329.
4. th Electronic Components and Technology Conf, San Diago, California, May. 2002, pp. 1195
5. th Electronic Components and Technology Conf, New Orleans, Louisiana, May. 2003, pp. 334