Comparison of substrate finishes for flip chip packages

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 30-37

  Bansal, Anurag ^a   Yoon, Sam ^a   Xie, John ^a   Li, Yuan ^a   Mahadev, Vadali ^a  

^a ALTERA CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENIG; FLIP CHIP PACKAGES; MECHANICAL SHOCKS; SURFACE FINISH;

BRITTLENESS; FRACTURE; NICKEL; PRINTED CIRCUIT BOARDS; SUBSTRATES; SURFACE PROPERTIES;

FLIP CHIP DEVICES;

EID: 24644450786     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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