Creep and microstructural evolution in lead-free microelectronic solder joints

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 417-422

  Dutta, I ^a   Park, C ^a   Choi, S ^a  

^a Naval Postgraduate School ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; CREEP; FLIP CHIP DEVICES; LEAD; MATHEMATICAL MODELS; MICROELECTRONICS; MICROSTRUCTURE; SILVER COMPOUNDS; STRAIN; THERMOMECHANICAL TREATMENT; COARSENING; CREEP TESTING; ELECTRONICS PACKAGING; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURAL EVOLUTION; SILVER ALLOYS; SOLDERING ALLOYS; TIN; TIN ALLOYS;

SOLDER ALLOYS; THERMOMECHANICAL CYCLING (TMC); ACCURATE PREDICTION; ALLOY COMPOSITIONS; CLOSED FORM; CREEP DATA; CREEP MODEL; CREEP RATES; CREEP STRAIN; FLIP CHIP; IMPRESSION CREEP; IMPRESSION CREEP TESTING; INTER-METALLIC PARTICLE; LEAD FREE SOLDERS; LEAD-FREE; LIFE PREDICTIONS; MICROSTRUCTURAL COARSENING; SECOND PHASE; SN-3.5AG SOLDERS; SN-AG ALLOYS; SOLDER JOINTS; THERMOMECHANICAL CYCLING;

SOLDERED JOINTS; CREEP RESISTANCE;

EID: 1242264739     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35209     Document Type: Conference Paper

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