Board strain states method and FCBGA mechanical shock analysis

International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System

Volumn , Issue , 2005, Pages 340-349

  Liang, Frank Z ^a   Williams, Richard L ^a   Hsieh, George ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Bend; BGA; Board strain; Shock; Solder joint; Strain states method

Indexed keywords

BEND; BGA; SHOCK; SOLDER JOINTS; STRAIN STATE;

BENDING TESTS; CHIP SCALE PACKAGES; EXHIBITIONS; MICROELECTRONICS; RELIABILITY ANALYSIS; SHOCK TESTING; STRAIN MEASUREMENT;

ACCELERATION;

EID: 84878253338     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Dave S. Steinberg, Vibration Analysis for Electronic Equipment, NY, 2000
2. Lei Mercado, Steven Girouard, and George Hsieh, "A Mechanics-Based Strain Gauge Methodology for Solder Joint Reliability Assessment," Proceedings of 5th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems, Brussels, Belgium, May 2004, pp533-541.
3. J. Varghese, A. Dasgupta, "Test Methodology For Impact Testing Of Portable Electronic Products," Proceedings of IMECE'03, 2003 ASME International Mechanical Engineering Congress & Exposition Washington, D. C., November 16-21, 2003.
4. E. Suhir, "Could Shock Tests Adequately Mimic Drop Tests Conditions?" Journal of Electronic Packaging, Sept. 2002, vol. 124, pp170-177.