MicroDAC strain measurement for electronics packaging structures

Optics and Lasers in Engineering

Volumn 36, Issue 2, 2001, Pages 195-211

  Vogel, D ^a   Grosser, V ^a   Schubert, A ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Correlation techniques; Electronics packaging; Material properties; MicroDAC strain measurement

Indexed keywords

ALGORITHMS; CHIP SCALE PACKAGES; CORRELATION METHODS; DEFORMATION; FLIP CHIP DEVICES; MICROELECTRONICS; POISSON RATIO; STRAIN MEASUREMENT; THERMAL EXPANSION; THERMAL STRESS;

MICROSCOPIC STRUCUTURES;

ELECTRONICS PACKAGING;

EID: 0035425174     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-8166(01)00034-3     Document Type: Article

References (14)

1. Applications of experimental mechanics to electronic packaging
2. Experimental and analytical evaluation of stress fields generated by solder bump interconnections
3. Thermal deformation analysis of various electronic packaging products by Moiré Interferometry
4. Underfill selection for flip-chip on organic printed circuit boards
5. Residual stress and thermal expansion of spun-on polyimide films
6. Stress-strain diagrams of microfabricated thin films
7. Study of vertical thermo-mechanical properties of polyimide thin films
8. MicroDAC-A novel approach to measure in situ deformation fields of microscopic scale
9. Deformation analysis on flip chip solder interconnects by microDAC
10. Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
11. Material mechanics and mechanical reliability for flip chip assemblies on organic substrates
12. Measurement of material properties by a modified microDAC approach