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Volumn 36, Issue 2, 2001, Pages 195-211

MicroDAC strain measurement for electronics packaging structures

Author keywords

Correlation techniques; Electronics packaging; Material properties; MicroDAC strain measurement

Indexed keywords

ALGORITHMS; CHIP SCALE PACKAGES; CORRELATION METHODS; DEFORMATION; FLIP CHIP DEVICES; MICROELECTRONICS; POISSON RATIO; STRAIN MEASUREMENT; THERMAL EXPANSION; THERMAL STRESS;

EID: 0035425174     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-8166(01)00034-3     Document Type: Article
Times cited : (63)

References (14)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.