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Volumn 36, Issue 2, 2001, Pages 195-211
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MicroDAC strain measurement for electronics packaging structures
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Author keywords
Correlation techniques; Electronics packaging; Material properties; MicroDAC strain measurement
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Indexed keywords
ALGORITHMS;
CHIP SCALE PACKAGES;
CORRELATION METHODS;
DEFORMATION;
FLIP CHIP DEVICES;
MICROELECTRONICS;
POISSON RATIO;
STRAIN MEASUREMENT;
THERMAL EXPANSION;
THERMAL STRESS;
MICROSCOPIC STRUCUTURES;
ELECTRONICS PACKAGING;
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EID: 0035425174
PISSN: 01438166
EISSN: None
Source Type: Journal
DOI: 10.1016/S0143-8166(01)00034-3 Document Type: Article |
Times cited : (63)
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References (14)
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