Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 85-94

  Lall, Pradeep ^a   Choudhaiy, Prakriti ^a   Gupte, Sameep ^a   Suhling, Jeff ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DAMAGE INDEX; DAMAGE PROGRESSION; ELECTRONIC ASSEMBLY;

BENDING (DEFORMATION); BOUNDARY CONDITIONS; FAILURE (MECHANICAL); IMPACT TESTING; MICROELECTRONICS; PATTERN RECOGNITION; VIBRATIONS (MECHANICAL);

ELECTRONIC EQUIPMENT;

EID: 33845563914     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645630     Document Type: Conference Paper

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