A comparative study on drop test performance of fine pitch BGA assemblies using Pb-free and tin-lead solders

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 865-874

  Dongji, Xie ^a   Rooney, Daniel T ^a   Geiger, David ^a   Shangguan, Dongkai ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERMETALLICS; SURFACE TOPOGRAPHY;

BALL GRID ARRAY (BGA); BOARD-LEVEL FREE FALL DROP (BFFD); PHONE LEVEL DROP TEST (PFFD); STRAIN STRESS ANALYSIS; SURFACE FINISHES;

SOLDERED JOINTS;

EID: 33845573620     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645758     Document Type: Conference Paper

References (9)

1. Fujitsu, http://www.fujitsu.com/downloads /MICRO/fma/pdf/leadfree.pdf. 2002.
2. Shi-Wei Ricky Lee, Yin-Lai Tracy Li and Hoi-Wai Ben Lui, Experimental Evaluation on Solder Joint Reliability of PBGA Assembly Under Mechanical Drop Test", Proceedings of IMECE2002, November 17-22, 2002, New Orleans, Louisiana, IMECE2002-39493.
3. JESD-B104, Standard Method for Board Level Mechanical Shock Test of Components for Handheld Electronic Systems Application.
4. Dongji Xie, Minna Arra, Sammy Yi and Dan Rooney, Solder Joint Behavior of Area Array Packages in Board Level Drop for Handheld Devices, Electronic Components and Technology Conference, 2003.
5. Dongji Xie, David Geiger, Dongkai Shangguan, Daniel T. Rooney and Louis J. Gullo, "Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)", Proceedings of IPACK05, July 17-22, 2005, San Francisco, CA, USA, IPACK2005-73484
6. Shi Xunqing, Yang Qianjin, Wang Zhiping, Xie Dongji, Shi Zhaofeng, New Creep Constitutive Relationship and Modified Energy-Based Life Prediction Model for Eutectic Solder Alloys, SIMTech Technical Report (PT/01/021/JT), 2001.
7. XQ. Shi, W. Zhou, H.L.J. Pang, Z.P. Wang, Y.P. Wang, "Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy", Journal of Electronic Packaging, Transactions of the ASME, Vol.121, pp. 179-185, September 1999.
8. JHL Pang, BS Xiong, CC Neo, XR Zhang, TH Low-Bulk Solder and Solder Joint Properties for Lead-Free 95.5 Sn-3.8 Ag-0.7 Cu Solder Alloy Electronic Components and Technology Conference, 2003, p675.
9. Dongji Xie, Minna Arra, Dongkai Shangguan, Hoang Phan, David Geiger and Sammy Yi, "Life Prediction of Lead free Solder Joints for Handheld Products", Presented and published at Telecom Hardware Solutions Conference, Plano, Texas, USA, May 15-16, 2002.