Thermal cycle/aging reliability of lead free 0201 assemblies

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1940-1956

  Ghaffarian, Reza ^a   Ramkumar, S Manian ^b   Varanasi, Arun ^b  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

0201 assembly; Isothermal aging; Lead free process; Lead free surface finish; Modified apertures; Shear load; Thermal aging; Thermal cycle

Indexed keywords

0201 ASSEMBLY; ISOTHERMAL AGING; LEAD FREE PROCESS; LEAD FREE SURFACE FINISHES; MODIFIED APERTURES; SHEAR LOADS; THERMAL AGING;

LEAD; OPTICAL INTERCONNECTS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMAL CYCLING;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 33845579512     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645927     Document Type: Conference Paper

References (10)

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