Measurement of deformation and strain in first level C4 interconnect and stacked die using optical digital image correlation

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1874-1881

  Kehoe, Liam ^a   Lynch, Pat ^a   Guénebaut, Vincent ^a  

^a Optical Metrology Innovations Ltd   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; DEFORMATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; IMAGE PROCESSING; STRAIN MEASUREMENT;

CONTOUR (FRINGE) MAPS; DIGITAL IMAGE CORRELATION (DIC); IMAGE CORRELATION TECHNIQUE; STACKED INTEGRATED CIRCUIT DIES;

OPTICAL INTERCONNECTS;

EID: 33845573992     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645916     Document Type: Conference Paper

References (3)

1. th IMAPS International Symposium on Microelectronics, Philadelphia, Pennsylvania, U.S.A., September 25-29 2005
2. Mark C. Pitter, Chung W. See and Michael G. Somekh, "Subpixel microscopic deformation analysis using correlation and artificial neural networks", Optics Express Vol. 8, No. 6, pp.322-327, 12 March 2001
3. M. Sjödahl, "Electronic speckle photography: increased accuracy by nonintegral pixel shifting," Appl. Opt. Vol. 33, pp. 6667-6673 (1994).)