Effect of hygrothermal aging on interfacial reliability of flip chip on board (FCOB) assembly

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 404-409

  Zhang, Y L ^a   Shi, X Q ^b   Zhou, W ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; FRACTURE TOUGHNESS; HYDROGEN BONDS; MORPHOLOGY;

HYGROTHERMAL AGING; INTERFACIAL RELIABILITY;

ELECTRONICS PACKAGING;

EID: 28444438187     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

1. Okura, J. H. Dasgupta, A. and Caers, J. F. J. M., "Hygro-Mechanical Durability of Underfilled Flip-Chip-on-board (FCOB) Interconnects," Journal of Electronic Packaging, Vol. 124, Sep, (2002), pp. 184-187.
2. th Electronic Components and Technology Conf, (1998), pp. 1372-1378.
3. Wong, E. H. Rajoo, R. Koh, S. W. and Lim, T. B., "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging," Journal of Electronic Packaging, Vol. 124, (2002), pp. 122-126.
4. rd Eurosime Conf., Paris, France, (2002), pp. 347-355.
5. Ferguson, T. and Qu, J. M., "Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface," Journal of Electronic Packaging, vol. 124, (2002), pp. 106-110.
6. Wong, E. H. Koh, S. W. Lee, K. H. and Rajoo, R., "Comprehensive Treatment of Moisture Induced Failure-Recent Advances," IEEE Transaction on Electronics Packaging Manufacturing, Vol. 25, No. 3, (2002), pp. 223-230.
7. Park, C. E. Han, B .J. and Bair, H. E., "Humidity Effect on Adhesion Strength Between Solder Ball and Epoxy Underfills," Polymer, Vol. 38, No. 15, (1997), pp. 3811-3818.
8. Bruck, H. A. McNeill, S. R. Sutton, M. A. and Peters, W. H., "Digital image correlation using Newton-Raphson method of partial differential correlation. Experimental Mechanics," Experimental Mechanics, Vol. 29, (1989), pp. 261-267.
9. Shi, X. Q. Wang, Z. P. and Pickering, J. P., "A New Methodology for the Characterization of Fracture Toughness of Filled Epoxy Films Involved in Microelectronics Packages," Microelectronics Reliability, Vol. 43, (2003), pp. 1105-1115.
10. th ECTC 2004.
11. Dunders, J., "Edge-Bonded Dissimilar Orthogonal Elastic Wedges," ASME J. Appl. Mech., vol. 36, (1969), pp. 650-652.
12. Rice, J. R., "Elastic Fracture Mechanics Concepts for Interfacial Cracks," Journal of Applied Mechanics, vol. 55, 1988, pp. 98-10.
13. D. R. J. Owen and A. J. Fawkes, "Engineering fracture mechanics: numerical methods and applications, " Pineridge Press Ltd., (Swansea U. K. 1983).
14. Crank, J. and Park, G. S., "The Mathematics of Diffusion," Oxford University Press, (1956).
15. Wang, J. Qian, Z. Zou, D. and Liu, S., "Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moiré Interferometry," Journal of Electronic Packaging, Vol. 120, (1998), pp. 179-185.
16. Sung, Y. Goh, J. S. and Yang, J. C., "Residual Stresses in Plastic IC Packages During Surface Mounting process Preceded by Moisture Soaking Testing," IEEE Transaction on CPMT-Part B, Vol. 20, No. 3, (1997), pp. 247-254.
17. Kwei, T. K., Wang, T. T., and Zupko, H. M., "Diffusion in glassy polymers V. Combination of Fickian and case II mechanisms", Macromolecules, Vol. 5, (1972), pp. 645-646.
18. Kinloch, A. J., "Adhesion and Adhesives: Science and Technology", Chapman and Hall, (New York, 1987).