Reliability of lead (Pb) free SAC solder interconnects with different PWB surface finishes under mechanical loading

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1038-1048

  Hossain, Mohammad M ^b   Zahedi, Fahad ^b   Agonafer, Dereje ^a,b   Viswanadham, Puligandla ^c   Dunford, Steven O ^c  

^a ASME

^b UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

^c NOKIA RESEARCH CENTER   (United States)

Author keywords

Cyclic fatigue bend; Drop test; Finite element modeling; Lead free solder; surface finish; Solder joint reliability

Indexed keywords

CYCLIC FATIGUE BEND; DROP TESTS; FINITE ELEMENT MODELING; LEAD FREE SOLDER; SOLDER JOINT RELIABILITY;

BENDING (DEFORMATION); COMPUTER SIMULATION; FINITE ELEMENT METHOD; LARGE SCALE SYSTEMS; MATHEMATICAL MODELS; RELIABILITY THEORY;

SOLDERING ALLOYS;

EID: 33845586306     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645459     Document Type: Conference Paper

References (7)

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2. Darveaux, R., "Reliability of Area Array Solder Joints in Bending", SMTA International conferences, 2002.
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7. Zhan, B.A., "Solder Joint Fatigue Life Model Methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu Materials", 2003 Electronic Components and Technology Conference