Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1154-1159

  Xu, Luhua ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR GROWTH; SHEAR STRENGTH; SOLDERED JOINTS; TIN COMPOUNDS;

CATHODE INTERFACE; LAYER GROWTH; MICRO DIGITAL IMAGE SPECKLE CORRELATION SYSTEM (MICRO-DISC); SHEAR STRAIN;

ELECTROMIGRATION;

EID: 33845575292     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645799     Document Type: Conference Paper

References (10)

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