Thermal deformation analysis of BGA package by digital image correlation technique

Microelectronics International

Volumn 22, Issue 1, 2005, Pages 34-42

  Zhang, J ^a   Li, M ^a   Xiong, C Y ^a   Fang, J ^a   Yi, S ^b  

^a PEKING UNIVERSITY   (China)

^b Portland State University   (United States)

Author keywords

Deformation; Electronics industry; Packaging; Stress (materials)

Indexed keywords

EID: 13844296812     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360510575530     Document Type: Article

References (9)