Effect of loading mode, temperature and moisture on interface fracture toughness of silicon/underfill/silicon sandwiched system

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1147-1152

  Song, G Q ^a   Shi, X Q ^b   Qin, F ^b   He, C F ^b  

^a NANCHANG UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Digital image correlation; Interface fracture toughness; Loading mode; Moisture; Reliability design; Temperature

Indexed keywords

CORRELATION METHODS; FAILURE (MECHANICAL); IMAGE PROCESSING; INTERFACES (MATERIALS); LOADS (FORCES); MICROPROCESSOR CHIPS; MOISTURE; THERMAL EFFECTS;

DIGITAL IMAGE CORRELATION; INTERFACE FRACTURE TOUGHNESS; LOADING MODE; RELIABILITY DESIGN; SANDWICHED SYSTEMS;

FRACTURE TOUGHNESS;

EID: 33845582785     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645474     Document Type: Conference Paper

References (12)

1. Shi X. Q., Wang Z. P., and Pickering J. P., "A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages," Microelectronics Reliability, Vol. 43, pp. 1105-1115, 2003.
2. Yan X., and Agarwal R. K., "Two test specimens for determining the interfacial fracture toughness in flip-chip assemblies," ASME Journal of Electronic Packaging, Vol. 120, pp. 150-155, 1998.
3. Jiao J., Gurumurthy C. K., Kramer E. J., Sha Y., Hui C. Y., and Borgesen P., "Measurement of interfacial fracture toughness under combined mechanical and thermal stresses," ASME Journal of Electronic Packaging, Vol. 120, pp. 349-353, 1998.
4. Wang J. J., Lu M. F., Zou D. Q., and Liu S., "Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load," IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, Vol. 21, pp. 79-86, 1998.
5. Pang H. L. J., Zhang X. R., Shi X. Q., andWang Z. P., "Interfacial fracture toughness test methodology for adhesive bonded joints," IEEE Transactions on Components, Packaging and Manufacturing Technology, Part-A, Vol. 25, pp. 187-191, 2002.
6. Sung Y., Goh J. S., and Yang J. C., "Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking testing," IEEE Transaction on Components, Packaging, and manufacturing Technology, Part B, Vol. 20, pp. 247-254, 1997.
7. Gurumurthy C. K., Kramer E. J., and Hui C. Y., "Water-assisted sub-critical crack growth along an interface between polyimide passivation and epoxy underfill," International Journal of Fracture, Vol. 109, pp. 1-28, 2001.
8. Shi X. Q., Wang Z. P., Pang H. L. J., and Zhang X. R., "Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens," Polymer Testing, Vol. 21, pp. 725-733, 2002.
9. Shi X. Q., Pang H. L. J., and Zhang X. R., "Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moire interferometry system," Microelectronics Reliability, Vol. 44, pp. 841-852, 2004.
10. Rice J. R., "Elastic Fracture Mechanics Concepts for Interfacial Cracks," Journal of Applied Mechanics, vol. 55, pp. 98-10, 1988.
11. Shi X. Q., Pang H. L. J., Zhang X. R., Liu Q. J., and Ying M., "In-situ micro-digital image speckle correlation technique for characterization of materials' properties and verification of numerical models," IEEE Transactions on Components and Packaging Technologies, Vol. 27, pp. 659-667, 2004.
12. Kinloch A. J., "Adhesion and adhesives: science and technology", Chapman and Hall, New York, 1987, pp. 56-96.