Dynamic materials testing and modeling of solder interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 1075-1079

  Ong, K C ^a   Tan, V B C ^a   Lim, C T ^a   Wong, E H ^b   Zhang, X W ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BULK PROPERTIES; DYNAMIC MATERIAL TESTING; DYNAMIC PROPERTIES; SOLDER INTERCONNECTS;

COMPUTER SIMULATION; DEFORMATION; DYNAMIC MECHANICAL ANALYSIS; FINITE ELEMENT METHOD; FRACTURE; IMPACT TESTING; MATHEMATICAL MODELS; OPTICAL INTERCONNECTS; STRAIN RATE; TENSILE STRESS;

SOLDERING ALLOYS;

EID: 10444237197     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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