Thermal deformation measurement by digital image correlation method

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 921-927

  Sun, Yaofeng ^a,c   Pang, John H L ^a   Shi, Xunqing ^b   Tew, J W Ronnie ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Digital image correlation; Electronic packaging; Thermal deformation measurement

Indexed keywords

COMPUTER VISION; DEFORMATION; IMAGE ANALYSIS; JOINTS (STRUCTURAL COMPONENTS); MEASUREMENT THEORY; THERMAL EFFECTS;

DIGITAL IMAGE CORRELATION; THERMAL DEFORMATION MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 33845583535     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645444     Document Type: Conference Paper

References (14)

1. W. H. Peters and W. F. Ranson, "Digital Imaging Techniques in Experimental Stress Analysis," Opt. Eng., 21 (3), 427-432 (1982).
2. M. A. Sutton, W. J. Wolters, W. H. Peters, W. F. Ranson and S. R. McNeil, "Determination of Displacements Using an Improved Digital Image Correlating Method," Image and Vision Computing, 1 (3), 133-139 (1983).
3. T. C. Chu, W. F. Ranson, M. A. Sutton and W. H. Peters, "Applications of Digital Image Correlation Techniques to Experimental Mechanics," Experimental Mechanics, 25, 232-244 (1985).
4. H. A. Bruck, S. R. McNeill, M. A. Sutton and W. H. Peters, "Digital Image Correlation Using Newton-Raphson Method of Partial Differential Correction," Experimental Mechanics, 29, 262-267 (1989).
5. G. Vendroux, and W. G. Knauss, "Submicron Deformation Field Meansurements: Part 2. Improved Digital Image Correlation," Experimental Mechanics, 38, 86-91 (1998).
6. Peng Zhou and Ken Goodson, "Thermomechanical diagnostics of BGA packages using digital image/speckle correlation," in Proceeding of ITHERM2000, 240-245 (2000)
7. F. Zhang, M. Li, C.Y. Xiong, F. Fang and S. Yi, "Thermal deformation analysis of BGA package by digital image correlation technique," Microelectronics International, 22 (1), 34-42, (2005)
8. Rajendra, D. Pendse and Peng Zhou, "Methodology for predicting solder joint reliability in semiconductor packages," Microelectronics Reliability, 42, 301-305 (2002)
9. D. Vogel, V. Grosser, A. Schubert and B. Michel, "MicroDAC strain measurement for electronics packaging structures," Optics and Lasers in Engineering 36, 195-211 (2001)
10. Y.L. Zhang, X.Q. Shi and W. Zhou, "Effect of Hygrothermal Aging on Interfacial Reliability of Flip Chip on Board (FCOB) Assembly," EPTC2004, 404-409 (2004)
11. H. W. Schreier and M. A. Sutton, "Systematic Errors in Digital Image Correlation Due to Undermatched Subset Shape Functions," Experimental Mechanics, 42, 303-310 (2002).
12. Sun Yaofeng and John H.L. Pang, "Determination of Optimal Subimage Size of Digital Image Correlation", Submitted to Image and Vision Comupting on Oct. 7, 2005.
13. RA. Muller, A. Buffington, "Real-time Correction of Atmospherically Degraded Telescope Images Through Image Sharpening", J. Opt. Soc. Am 64, 1200-1211 (1974)
14. A. Erteza, "Sharpness Index and its Application to Focus Control", Appl. Opt. 15, 877-881 (1976)