Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA)

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 356-363

  Chong, Desmond Y R ^a   Che, F X ^b   Xu, L H ^b   Toh, H J ^a,b   Pang, John H L ^b   Xiong, B S ^b   Lim, B K ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; ELECTROLESS PLATING; INTERMETALLICS; LEAD; METAL FINISHING; NICKEL ALLOYS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS;

ELECTROLESS NICKEL IMMERSION GOLD; FINE PITCH BALL GRID ARRAY (FBGA) PACKAGES; SCREW SUPPORT; THERMAL AGING EFFECTS;

CHIP SCALE PACKAGES;

EID: 33845581093     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645671     Document Type: Conference Paper

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