Lifetime modelling for microsystems integration: From nano to systems

Microsystem Technologies

Volumn 15, Issue 6, 2009, Pages 799-812

  Wunderle, Bernhard ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ANALYTICAL METHOD; COMPLEX SYSTEMS; DESIGN FOR RELIABILITY; ELECTRONICS SYSTEM; FAILURE BEHAVIOUR; FAILURE MECHANISM; IC TECHNOLOGY; LENGTH SCALE; LIFETIME PREDICTION; LOWER COST; MATERIAL INTERFACES; MICROELECTRONIC COMPONENTS; MINIATURISATION; NEW MATERIAL; RAPID DEVELOPMENT; SCIENTIFIC DISCIPLINE; SYSTEM IN PACKAGE; THERMOMECHANICAL RELIABILITY;

ELECTRONIC EQUIPMENT MANUFACTURE; PACKAGING MATERIALS; THREE DIMENSIONAL;

RELIABILITY;

EID: 67349203850     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0860-z     Document Type: Article

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