Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections

Microsystem Technologies

Volumn 15, Issue 1 SPEC. ISS., 2009, Pages 83-88

  Dressler M ^a   Becker, K F ^b   Wunderle, B ^b   Auersperg, J ^b   Reichl, H ^c  

^a ROBERT BOSCH GMBH   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; AUTOMOBILE SEATS; BRITTLENESS; CRACK PROPAGATION; DELAMINATION; DESIGN; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE MECHANICS; LIGHT SOURCES; LIQUID CRYSTAL POLYMERS; LIQUID CRYSTALS; MECHANICS; METAL CLADDING; OXYGEN; PLASMA APPLICATIONS; PLASMA DIAGNOSTICS; RELIABILITY; RISK ASSESSMENT; SENSOR NETWORKS; STEEL SHEET; STRENGTH OF MATERIALS;

AUTOMOTIVE SENSORS; BULK MATERIALS; BUTTON SHEAR TESTS; CRACK INITIATION AND PROPAGATIONS; CRITICAL ENERGIES; DESIGN RULES; DIFFERENT MODES; ELECTRICAL FAILURES; ELECTRONIC PACKAGES; ENERGY RELEASES; FINITE-ELEMENT ANALYSES; FLIP CHIPS; GEOMETRY DESIGNS; INFLUENCE OF OXYGENS; INTERFACIAL CRACKINGS; INTERFACIAL FRACTURE MECHANICS; MATERIAL PROPERTIES; PHYSICS-OF-FAILURE; STUD BUMP BONDINGS; SUBSTRATE MATERIALS; SUBSTRATE SIZES; TEFLON STRIPT; UNDERFILL;

SUBSTRATES;

EID: 54049095132     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0692-2     Document Type: Conference Paper

References (11)

1. J Auersperg E Kieselstein A Schubert B Michel 2002 Delamination risk evalulation for plastic packages based on mixed mode fracture mechanics approaches J Electron Packag 124 4 318 322
2. Becker K-F, Kilic N, Braun T, Koch M, Bader V, Aschenbrenner R et al (2003) New insights in underfill flow and flip chip reliability. APEX Conference, Anaheim
3. Dreßler M, Rohde H, Liebing G, Becker K-F, Wunderle B, Reichl H (2006a) Influence of assembly process, material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications. 7th international congress molded interconnect devices, 27-28 September 2006, Fuerth, Germany
4. Dreßler M, Rohde H, Liebing G, Auersperg J, Becker K-F, Wunderle B, Reichl H (2006b) Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applications. 1st Electronics systemintegration technology conference, Dresden, 41-50
5. Krueger R (2002). The virtual crack closure technique: history, approach and applications. NASA/CR-2002-211628, ICASE Report No. 2002-10
6. Nied HF (2003) Mechanics of interface fracture with applications in electronic packaging. IEEE Trans Device Mater Reliab 3(4)
7. EF Rybicki MF Kanninen 1997 A finite element calculation of stress intensity factors by a modified crack closure integral Eng Fract Mech 9 931 938
8. R Schledjewski K Friedrich 1992 Tensile properties of filled liquid-crystal polymer systems J Mater Sci Lett 11 12 840 842
9. Sham L, Lam M, Kim J-K (2001) Adhesion characteristics of underfill material with various package components after plasma and UV/ozone treatment. Electronic Materials and Packaging, 2001 (EMAP 2001), Feju Island, South Korea, pp 208-215
10. Tay AAO, Phang JS, Wong EH, Ranjan R (2003) A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages. Electronic components and technology conference, 27-30 May 2003, New Orleans, Louisiana, USA, pp 1165-1169
11. Tong Q, Ma B, Xiao A, Savoca A, Luo S, Wong CP (2002) Fundamental adhesion issues for advanced flip chip packaging. Electronic components and technology conference, 28-31 May 2002, San Diego, California, USA