Rapid interface reliability testing of flip chip encapsulants

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1514-1521

  Rau, I ^a   Becker, K F ^b   Wunderle, B ^c   Reichl, H ^b  

^a Sekretariat TIB 4/2 1 ^*  (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; AUTOCLAVES; INTERFACES (MATERIALS); MATHEMATICAL MODELS; RELIABILITY ANALYSIS;

FLIP CHIP ENCAPSULANTS; INTERFACE RELIABILITY; RELIABILITY TESTING; VIBRATIONAL STRESSING;

FLIP CHIP DEVICES;

EID: 35348919985     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373995     Document Type: Conference Paper

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