Failure modeling of ACA-glued flip-chip on flex assemblies

Microsystem Technologies

Volumn 15, Issue 1 SPEC. ISS., 2009, Pages 3-15

  Wunderle, B ^a   Kallmayer, C ^a   Walter, H ^a   Braun, T ^a   Gollhardt, A ^a   Michel, B ^a   Reichl, H ^b  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; GLUING; MECHANICAL PROPERTIES; MOISTURE; QUALITY ASSURANCE; SILVER;

ANISOTROPIC CONDUCTIVE ADHESIVES; CHARACTERISATION; CHIP-ON-FLEX; CONTACT PRESSURES; DIRECT PREDICTIONS; FINITE ELEMENTS; INTERCONNECT FAILURES; LIFETIME TESTS; LOADING PARAMETERS; MATERIAL ANALYSES; MEAN TIME TO FAILURES; MODELING; PAPER ADDRESSES; PHYSICS-OF-FAILURE; QUANTITATIVE CHANGES; STRESS FIELDS; THERMO-MECHANICAL PROPERTIES;

FAILURE ANALYSIS;

EID: 54049139511     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0701-5     Document Type: Conference Paper

References (15)

1. R Aschenbrenner A Ostmann G Motula E Zakel 1997 Flip-chip attachment using anisotropic conductive adhesives and electroless nickel bumps IEEE Trans CPMT Part C 20 95 100
2. Caers (b) JFJM, Zhao XJ (2003) Prediction of moisture induced failure in flip chip on flex interconnections with non-conductive adhesives. In: Proceeding of the 53th ECTC, pp 1176-1180
3. JFJM Caers (a) JWC de Fries XJ Zhao EH Wong 2003 Some characteristics of anisotropic conductive adhesive and non-conductive adhesive flip chip on flex interconnections J Semicond Technol Sci 3 2 122 131
4. Carreker RP (1957) Tensile deformaton of silver as function of temperature, srain rate and grain size. J Metals Trans AIME 112-115
5. Dermitzaki E, Bauer J, Walter H, Wunderle B, Michel B, Reichl H (2007) Molecular dynamics simulation for the diffusion of water in amorphous polymers examined at different temperatures. In: Proceedings of the 8th EuroSimE conference
6. Ferry JD (1980) Viscoelastic properties of polymers, 3 edn. Wiley, New York
7. DCC Lam F Yang P Tong 1999 Chemical kinetic model of interfacial degradation of adhesive joints IEEE Trans Compon Packag Technol 22 2 215 220
8. Liu J (1998) Recent advances in conductive adhesives for direct chip attach applications. Microsyst Technol 5:72-80
9. J Liu XZ Lu L Cao 2007 Reliability aspects of electronics packaging technology using anisotropic conductive adhesives J Shanghai Univ 11 1 1 16 English edition
10. Miessner R, Aschenbrenner R, Reichl H (1999) Reliability study of flip-chip on FR-4 interconnects with ACA. In: Proceedings of the 49th ECTC, pp 595-601
11. LK Teh M Teo E Anto CC Wong SG Mhaisalkar PS Teo EH Wong 2005 Moisture-induced failures of adhesive flip chip interconnects IEEE Trans Compon Packag Technol 28 3 506 516
12. CML Wu J Liu NH Yeung 2001 The effects of bump height on the reliability of ACF in flip-chip Solder Surf Mount Technol 13 1 25 29
13. Wunderle B, Dudek R, Michel B, Reichl H (2004) Thermo-mechanical reliability of power flip-chip cooling concepts. In: Proceedings of the 54th electronic components and technology conference, Las Vegas, June 1-4, pp 427-436
14. Yin CY, Lu H, Bailey C, Chan YC (2005) Experimental and modeling analysis on moisture induced failures in flip chip on flex interconnections with anistotropic conductive film. In: Proceedings of the Asian green electronics, pp 172-177
15. ZL Zhang H Kristiansen J Liu 2007 A method for determining elastic properties of micron-sized polymer particles by using a flat punch test Comput Materials Sci 39 305 314